TIBPAL16R4-30MJB vs PAL16R4AMJB feature comparison

TIBPAL16R4-30MJB Texas Instruments

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PAL16R4AMJB Monolithic Memories (RETIRED)

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Pbfree Code Yes
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC MONOLITHIC MEMORIES
Part Package Code DIP
Package Description DIP, DIP20,.3 DIP, DIP20,.3
Pin Count 20
Reach Compliance Code not_compliant unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.31.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Architecture PAL-TYPE PAL-TYPE
Clock Frequency-Max 30 MHz
In-System Programmable NO
JESD-30 Code R-GDIP-T20 R-XDIP-T20
JESD-609 Code e0 e0
JTAG BST NO
Length 24.195 mm
Number of Dedicated Inputs 8
Number of I/O Lines 4
Number of Inputs 12 12
Number of Outputs 8 8
Number of Product Terms 64 64
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 8 DEDICATED INPUTS, 4 I/O
Output Function MIXED REGISTERED
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programmable Logic Type OT PLD OT PLD
Propagation Delay 30 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-STD-883 Class B (Modified)
Seated Height-Max 5.08 mm
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm
Base Number Matches 1 3

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