TH8056KDC-AAA-014-RE
vs
MCP201-I/MF
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MELEXIS N V
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
HSOP,
|
HVSON,
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Melexis
|
|
JESD-30 Code |
R-PDSO-G14
|
R-PDSO-N8
|
JESD-609 Code |
e3
|
e3
|
Length |
8.65 mm
|
5.99 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
14
|
8
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HSOP
|
HVSON
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Seated Height-Max |
1.72 mm
|
1 mm
|
Supply Voltage-Nom |
12 V
|
12 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3.9 mm
|
4.92 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
DFN
|
Pin Count |
|
8
|
Moisture Sensitivity Level |
|
1
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare TH8056KDC-AAA-014-RE with alternatives
Compare MCP201-I/MF with alternatives