TG2401F vs U7004B-MFSG3 feature comparison

TG2401F Toshiba America Electronic Components

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U7004B-MFSG3 Atmel Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP ATMEL CORP
Part Package Code SOIC SOIC
Package Description HTSSOP, SSO-20
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e0 e0
Length 5 mm 6.625 mm
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C -25 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HTSSOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.04 mm
Supply Current-Max 170 mA
Supply Voltage-Nom 3 V 3.6 V
Surface Mount YES YES
Technology GAAS BIPOLAR
Telecom IC Type CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT CORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature Grade INDUSTRIAL OTHER
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 4.4 mm
Base Number Matches 1 1

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Compare U7004B-MFSG3 with alternatives