TFRA28J133BAL-1-DB
vs
TXC-06836AIOG
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
AVAGO TECHNOLOGIES INC
TRANSWITCH CORP
Package Description
BGA,
BGA,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B456
S-PBGA-B456
JESD-609 Code
e0
Length
35 mm
27 mm
Number of Functions
1
1
Number of Terminals
456
456
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.54 mm
Supply Voltage-Nom
3.3 V
1.8 V
Surface Mount
YES
YES
Telecom IC Type
FRAMER
FRAMER
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
35 mm
27 mm
Base Number Matches
1
1
Part Package Code
BGA
Pin Count
456
Category CO2 Kg
12.04
Compliance Temperature Grade
Industrial: -40C to +85C
Supply Current-Max
476 mA
Compare TFRA28J133BAL-1-DB with alternatives
Compare TXC-06836AIOG with alternatives