TEF6730HW
vs
TDA18271HD/C2,518
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFP
|
QFN
|
| Package Description |
HTFQFP,
|
HQCCN, LCC64,.35SQ,20
|
| Pin Count |
64
|
64
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Built-in IF Amplifier |
YES
|
YES
|
| Consumer IC Type |
AUDIO TUNER
|
VIDEO TUNER
|
| Input Frequency-Max (RF) |
108 MHz
|
864 MHz
|
| Input Frequency-Min (RF) |
65 MHz
|
45 MHz
|
| JESD-30 Code |
S-PQFP-G64
|
S-PQCC-N64
|
| Length |
10 mm
|
9 mm
|
| Noise Figure-Nom |
3.5 dB
|
5.5 dB
|
| Number of Bands |
2
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
64
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTFQFP
|
HQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG
|
| Seated Height-Max |
1.2 mm
|
1.7 mm
|
| Supply Voltage-Max (Vsup) |
9 V
|
3.47 V
|
| Supply Voltage-Min (Vsup) |
8 V
|
3.13 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
10 mm
|
9 mm
|
| Base Number Matches |
2
|
1
|
| Manufacturer Package Code |
|
SOT903-1
|
| Package Equivalence Code |
|
LCC64,.35SQ,20
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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