TEA1622P/N1,112
vs
FSDL0365RL
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FAIRCHILD SEMICONDUCTOR CORP
|
| Part Package Code |
MO-001
|
SOIC
|
| Package Description |
DIP,
|
SOP, SOP8,.4
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Mode |
VOLTAGE-MODE
|
CURRENT-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Min |
8 V
|
9 V
|
| Input Voltage-Nom |
8.5 V
|
14 V
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G8
|
| JESD-609 Code |
e4
|
e3
|
| Length |
9.5 mm
|
9.2 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-25 °C
|
| Output Current-Max |
1 A
|
12 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP8,.3
|
SOP8,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.2 mm
|
3.7 mm
|
| Surface Mount |
NO
|
YES
|
| Switcher Configuration |
SINGLE
|
SINGLE
|
| Switching Frequency-Max |
200 kHz
|
55 kHz
|
| Technology |
BICMOS
|
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
TIN
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.62 mm
|
6.4 mm
|
| Base Number Matches |
1
|
1
|
| Input Voltage-Max |
|
20 V
|
| Moisture Sensitivity Level |
|
1
|
|
|
|
Compare TEA1622P/N1,112 with alternatives
Compare FSDL0365RL with alternatives