TDF8551J vs TDA8595TH/N2/R4,11 feature comparison

TDF8551J NXP Semiconductors

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TDA8595TH/N2/R4,11 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOT SOIC
Package Description PLASTIC, SOT725-1, SIL-37 PLASTIC, SOT-851-2, SOP-36
Pin Count 37 36
Manufacturer Package Code SOT725-1 SOT851-2
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.33.00.01
Bandwidth-Nom 22 kHz 22 kHz
Consumer IC Type AUDIO AMPLIFIER AUDIO AMPLIFIER
Harmonic Distortion 1% 10%
JESD-30 Code R-PZFM-T37 R-PDSO-G36
Number of Channels 4 4
Number of Functions 1 1
Number of Terminals 37 36
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
Output Power-Nom 69 W 64 W
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT SMALL OUTLINE, SHRINK PITCH
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 8 V 8 V
Surface Mount NO YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Position ZIG-ZAG DUAL
Base Number Matches 2 1
Gain 26 dB
Length 15.9 mm
Package Code SSOP
Seated Height-Max 3.5 mm
Technology BCDMOS
Terminal Pitch 0.65 mm
Width 11 mm

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