TDE1897CDP vs TDE1897RFPT feature comparison

TDE1897CDP STMicroelectronics

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TDE1897RFPT STMicroelectronics

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code DIP SOIC
Package Description MINI, DIP-8 SO-20
Pin Count 8 20
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer STMicroelectronics STMicroelectronics
Built-in Protections OVER CURRENT; THERMAL; UNDER VOLTAGE OVER CURRENT; THERMAL; UNDER VOLTAGE
Driver Number of Bits 1 1
Interface IC Type BUFFER OR INVERTER BASED PERIPHERAL DRIVER BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code R-PDIP-T8 R-PDSO-G20
JESD-609 Code e3
Number of Functions 1 1
Number of Terminals 8 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Output Current Flow Direction SOURCE SINK
Output Current-Max 0.625 A 0.5 A
Output Peak Current Limit-Nom 0.75 A 0.75 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP8,.35 SOP20,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 2.65 mm
Supply Voltage-Max 35 V 35 V
Supply Voltage-Min 18 V 18 V
Supply Voltage-Nom 24 V 24 V
Supply Voltage1-Max 35 V 35 V
Supply Voltage1-Min 9 V 9 V
Surface Mount NO YES
Technology BCDMOS BCDMOS
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Turn-off Time 20 µs 20 µs
Turn-on Time 100 µs 100 µs
Width 7.62 mm 7.5 mm
Base Number Matches 1 1
Factory Lead Time 18 Weeks
Length 12.8 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED