TDA9181P vs NJM2257M(TE2) feature comparison

TDA9181P NXP Semiconductors

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NJM2257M(TE2) New Japan Radio Co Ltd

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Pbfree Code Yes Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS NEW JAPAN RADIO CO LTD
Part Package Code DIP SOIC
Package Description 0.300 INCH, PLASTIC, SOT38-4, DIP-16 SOP,
Pin Count 16 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01
Consumer IC Type Y/C SEPARATOR IC SYNC SEPARATOR IC
JESD-30 Code R-PDIP-T16 R-PDSO-G16
Length 19.05 mm 10 mm
Number of Functions 1
Number of Terminals 16 16
Operating Temperature-Max 70 °C 75 °C
Operating Temperature-Min -25 °C -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.3 V
Supply Voltage-Min (Vsup) 4.5 V 4.7 V
Surface Mount NO YES
Temperature Grade OTHER COMMERCIAL EXTENDED
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 5 mm
Base Number Matches 1 1
JESD-609 Code e6
Moisture Sensitivity Level 2
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN BISMUTH
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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