TDA8357J
vs
TDA8356
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
ZIP
|
SIP
|
Package Description |
POWER, PLASTIC, SOT-523-1, DIL-BENT-SIL, 9 PIN
|
POWER, PLASTIC, SOT-131-2, SIP-9
|
Pin Count |
9
|
9
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Blanking Output |
NO
|
NO
|
Consumer IC Type |
VERTICAL DEFLECTION IC
|
VERTICAL DEFLECTION IC
|
JESD-30 Code |
R-PZIP-T9
|
R-PSIP-T9
|
JESD-609 Code |
e3
|
e3
|
Length |
13 mm
|
23.8 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
9
|
9
|
Operating Temperature-Max |
85 °C
|
75 °C
|
Operating Temperature-Min |
-25 °C
|
-25 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
ZIP
|
SIP
|
Package Equivalence Code |
ZIP9,.2
|
SIP9,.1
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
21.4 mm
|
14.2 mm
|
Supply Voltage-Max (Vsup) |
18 V
|
25 V
|
Supply Voltage-Min (Vsup) |
7.5 V
|
9 V
|
Surface Mount |
NO
|
NO
|
Technology |
BCDMOS
|
BIPOLAR
|
Temperature Grade |
OTHER
|
COMMERCIAL EXTENDED
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
ZIG-ZAG
|
SINGLE
|
Width |
2.5 mm
|
4.4 mm
|
Base Number Matches |
1
|
3
|
Samacsys Manufacturer |
|
NXP
|
|
|
|
Compare TDA8357J with alternatives
Compare TDA8356 with alternatives