TDA8035HN/C2/S1J
vs
TDA8035HN/C2/S1QL
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
HVQCCN,
|
|
| Pin Count |
32
|
32
|
| Manufacturer Package Code |
SOT617-7
|
SOT617-7
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
13 Weeks
|
13 Weeks
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
| JESD-30 Code |
S-PQCC-N32
|
|
| JESD-609 Code |
e4
|
|
| Length |
5 mm
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
|
| Number of Terminals |
32
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-25 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
HVQCCN
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
NO LEAD
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
5 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|