TDA7569BLVSMTR
vs
TDA7569BLVPD
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Samacsys Manufacturer |
STMicroelectronics
|
STMicroelectronics
|
| Consumer IC Type |
CLASS AB AUDIO AMPLIFIER
|
CLASS AB AUDIO AMPLIFIER
|
| JESD-30 Code |
R-PZIP-T27
|
R-PDSO-G36
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
27
|
36
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
ZIP
|
SSOP
|
| Package Equivalence Code |
ZIP27H,.08,.7
|
SSOP36,.56
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
245
|
245
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
250 mA
|
250 mA
|
| Surface Mount |
NO
|
YES
|
| Technology |
BCDMOS
|
BCDMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Tin (Sn)
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.635 mm
|
| Terminal Position |
ZIG-ZAG
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Factory Lead Time |
|
52 Weeks
|
|
|
|
Compare TDA7569BLVSMTR with alternatives
Compare TDA7569BLVPD with alternatives