TDA7564BPD
vs
LV47002P
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
ON SEMICONDUCTOR
|
| Part Package Code |
SOIC
|
|
| Package Description |
HSSOP, SSOP36,.56
|
ZIP, ZIP25,.16,.16,40
|
| Pin Count |
36
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Bandwidth-Nom |
22 kHz
|
|
| Consumer IC Type |
CLASS AB AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
| Gain |
26 dB
|
|
| Harmonic Distortion |
10%
|
|
| JESD-30 Code |
R-PDSO-G36
|
R-PZIP-T25
|
| JESD-609 Code |
e3
|
|
| Length |
15.9 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Channels |
4
|
|
| Number of Functions |
1
|
4
|
| Number of Terminals |
36
|
25
|
| Output Power-Nom |
50 W
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HSSOP
|
ZIP
|
| Package Equivalence Code |
SSOP36,.56
|
ZIP25,.16,.16,40
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.41 mm
|
|
| Supply Current-Max |
300 mA
|
400 mA
|
| Supply Voltage-Max (Vsup) |
18 V
|
|
| Supply Voltage-Min (Vsup) |
8 V
|
|
| Surface Mount |
YES
|
NO
|
| Technology |
BCDMOS
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
1 mm
|
| Terminal Position |
DUAL
|
ZIG-ZAG
|
| Width |
11 mm
|
|
| Base Number Matches |
1
|
2
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare TDA7564BPD with alternatives