TDA7564BPD
vs
TDA7563B
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
Part Package Code |
SOIC
|
ZFM
|
Package Description |
HSSOP, SSOP36,.56
|
FLEXIWATT-27
|
Pin Count |
36
|
27
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Bandwidth-Nom |
22 kHz
|
22 kHz
|
Consumer IC Type |
CLASS AB AUDIO AMPLIFIER
|
CLASS AB AUDIO AMPLIFIER
|
Gain |
26 dB
|
30 dB
|
Harmonic Distortion |
10%
|
10%
|
JESD-30 Code |
R-PDSO-G36
|
R-PZFM-T27
|
JESD-609 Code |
e3
|
e3
|
Length |
15.9 mm
|
|
Moisture Sensitivity Level |
3
|
3
|
Number of Channels |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Terminals |
36
|
27
|
Output Power-Nom |
50 W
|
50 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HSSOP
|
ZIP
|
Package Equivalence Code |
SSOP36,.56
|
ZIP27,.16,.16,40
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
FLANGE MOUNT
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.41 mm
|
|
Supply Current-Max |
300 mA
|
300 mA
|
Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
Supply Voltage-Min (Vsup) |
8 V
|
8 V
|
Surface Mount |
YES
|
NO
|
Technology |
BCDMOS
|
BCDMOS
|
Terminal Finish |
MATTE TIN
|
Tin (Sn)
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
0.65 mm
|
1 mm
|
Terminal Position |
DUAL
|
ZIG-ZAG
|
Width |
11 mm
|
|
Base Number Matches |
1
|
1
|
Factory Lead Time |
|
15 Weeks
|
Samacsys Manufacturer |
|
STMicroelectronics
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare TDA7564BPD with alternatives
Compare TDA7563B with alternatives