TDA7376PDTR
vs
TDA7575BPD
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
ROHS COMPLIANT, POWER, SOP-36
|
ROHS COMPLIANT, SOP-36
|
| Pin Count |
36
|
36
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Factory Lead Time |
15 Weeks
|
52 Weeks
|
| Samacsys Manufacturer |
STMicroelectronics
|
STMicroelectronics
|
| Bandwidth-Nom |
33 kHz
|
22 kHz
|
| Consumer IC Type |
CLASS AB AUDIO AMPLIFIER
|
CLASS AB AUDIO AMPLIFIER
|
| Gain |
26 dB
|
|
| Harmonic Distortion |
10%
|
10%
|
| JESD-30 Code |
R-PDSO-G36
|
R-PDSO-G36
|
| JESD-609 Code |
e3
|
e3
|
| Length |
15.9 mm
|
15.9 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
36
|
36
|
| Output Power-Nom |
37 W
|
50 W
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HSSOP
|
HSSOP
|
| Package Equivalence Code |
SSOP36,.56
|
SSOP36,.56
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
245
|
245
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.43 mm
|
3.43 mm
|
| Supply Current-Max |
200 mA
|
200 mA
|
| Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
8 V
|
8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BCDMOS
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
11 mm
|
11 mm
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare TDA7376PDTR with alternatives
Compare TDA7575BPD with alternatives