TDA7056AT/N2,518
vs
TDA7056B/N1,112
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOP
|
|
| Package Description |
7.50 MM, PLASTIC, MS-013AC, SOT163-1, SOP-20
|
SIP, SIP9,.1TB
|
| Pin Count |
20
|
9
|
| Manufacturer Package Code |
SOT163-1
|
SOT110-1
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.33.00.01
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| Consumer IC Type |
VOLUME CONTROL CIRCUIT
|
VOLUME CONTROL CIRCUIT
|
| Harmonic Distortion |
0.3%
|
0.3%
|
| JESD-30 Code |
R-PDSO-G20
|
R-PSIP-T9
|
| JESD-609 Code |
e4
|
|
| Length |
12.8 mm
|
|
| Moisture Sensitivity Level |
2
|
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
9
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
2.65 mm
|
|
| Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Surface Mount |
YES
|
NO
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
7.5 mm
|
|
| Base Number Matches |
1
|
1
|
| Package Equivalence Code |
|
SIP9,.1TB
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max |
|
13 mA
|
| Technology |
|
BIPOLAR
|
|
|
|
Compare TDA7056AT/N2,518 with alternatives
Compare TDA7056B/N1,112 with alternatives