TDA7052A/N2,112
vs
TDA7052AT/N2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
DIP
SOIC
Package Description
0.300 INCH, PLASTIC, MO-001, SC-504-8, SOT97-1, DIP-8
SO-8
Pin Count
8
8
Manufacturer Package Code
SOT97-1
Reach Compliance Code
unknown
unknown
HTS Code
8542.33.00.01
8542.33.00.01
Samacsys Manufacturer
NXP
NXP
Consumer IC Type
VOLUME CONTROL CIRCUIT
VOLUME CONTROL CIRCUIT
Harmonic Distortion
0.3%
0.3%
JESD-30 Code
R-PDIP-T8
R-PDSO-G8
Length
9.5 mm
Number of Channels
1
1
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.2 mm
Supply Current-Max
12 mA
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Surface Mount
NO
YES
Technology
BIPOLAR
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
1
Pbfree Code
ECCN Code
EAR99
JESD-609 Code
e4
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Terminal Finish
NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s)
30
Compare TDA7052A/N2,112 with alternatives
Compare TDA7052AT/N2 with alternatives