TD74BC374F
vs
HD74BC374AFPEL-E
feature comparison
Part Life Cycle Code |
Active
|
Not Recommended
|
Ihs Manufacturer |
TOSHIBA CORP
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
SOP,
|
SOP, SOP20,.3
|
Pin Count |
20
|
20
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
BCT/FBT
|
BCT/FBT
|
JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
JESD-609 Code |
e2
|
e4
|
Length |
12.8 mm
|
12.6 mm
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Number of Bits |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Equivalence Code |
SOP20,.3
|
SOP20,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Power Supply Current-Max (ICC) |
27 mA
|
|
Propagation Delay (tpd) |
10 ns
|
10 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.8 mm
|
2.2 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN COPPER/TIN SILVER
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
5.3 mm
|
5.5 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Max I(ol) |
|
0.048 A
|
Moisture Sensitivity Level |
|
1
|
Packing Method |
|
TR
|
Prop. Delay@Nom-Sup |
|
10 ns
|
Trigger Type |
|
POSITIVE EDGE
|
|
|
|
Compare TD74BC374F with alternatives
Compare HD74BC374AFPEL-E with alternatives