TD74BC374F vs HD74BC374AFPEL-E feature comparison

TD74BC374F Toshiba America Electronic Components

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HD74BC374AFPEL-E Renesas Electronics Corporation

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Part Life Cycle Code Active Not Recommended
Ihs Manufacturer TOSHIBA CORP RENESAS ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP20,.3
Pin Count 20 20
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family BCT/FBT BCT/FBT
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e2 e4
Length 12.8 mm 12.6 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP20,.3 SOP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Power Supply Current-Max (ICC) 27 mA
Propagation Delay (tpd) 10 ns 10 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.8 mm 2.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology BICMOS BICMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN COPPER/TIN SILVER NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.3 mm 5.5 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Max I(ol) 0.048 A
Moisture Sensitivity Level 1
Packing Method TR
Prop. Delay@Nom-Sup 10 ns
Trigger Type POSITIVE EDGE

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Compare HD74BC374AFPEL-E with alternatives