TD62082AP
vs
ULN2804A
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TOSHIBA CORP
|
STMICROELECTRONICS
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
IN-LINE, R-PDIP-T18
|
DIP-18
|
| Pin Count |
18
|
18
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Additional Feature |
LOGIC LEVEL COMPATIBLE
|
LOGIC LEVEL COMPATIBLE
|
| Collector Current-Max (IC) |
0.5 A
|
0.5 A
|
| Collector-Emitter Voltage-Max |
50 V
|
50 V
|
| Configuration |
8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR
|
COMPLEX
|
| DC Current Gain-Min (hFE) |
1000
|
|
| JESD-30 Code |
R-PDIP-T18
|
R-PDIP-T18
|
| JESD-609 Code |
e0
|
|
| Number of Elements |
8
|
8
|
| Number of Terminals |
18
|
18
|
| Operating Temperature-Max |
85 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin (Sn) - immersion
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| VCEsat-Max |
1.6 V
|
|
| Base Number Matches |
2
|
1
|
| Factory Lead Time |
|
16 Weeks, 3 Days
|
| Samacsys Manufacturer |
|
STMicroelectronics
|
| Operating Temperature-Min |
|
-20 °C
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare TD62082AP with alternatives
Compare ULN2804A with alternatives