TCM809RENB713
vs
TCM810RENB723
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TELCOM SEMICONDUCTOR INC
|
| Part Package Code |
SOT-23
|
|
| Package Description |
PLASTIC, TO-236, SOT-23B, 3 PIN
|
,
|
| Pin Count |
3
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
11 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Adjustable Threshold |
NO
|
NO
|
| Analog IC - Other Type |
VOLTAGE SUPERVISOR/RESET IC
|
VOLTAGE SUPERVISOR/RESET IC
|
| JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
| JESD-609 Code |
e3
|
|
| Length |
2.92 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SOP
|
| Package Equivalence Code |
TO-236
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
1.12 mm
|
|
| Supply Current-Max (Isup) |
0.025 mA
|
0.05 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1 V
|
1.2 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.96 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Threshold Voltage-Nom |
+2.63V
|
2.63
|
| Width |
1.3 mm
|
|
| Base Number Matches |
3
|
1
|
|
|
|
Compare TCM809RENB713 with alternatives
Compare TCM810RENB723 with alternatives