TCM810RENB723 vs TCM810RENBG feature comparison

TCM810RENB723 Telcom Semiconductor Inc

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TCM810RENBG Microchip Technology Inc

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer TELCOM SEMICONDUCTOR INC MICROCHIP TECHNOLOGY INC
Package Description , TSOP,
Reach Compliance Code unknown compliant
Adjustable Threshold NO NO
Analog IC - Other Type VOLTAGE SUPERVISOR/RESET IC VOLTAGE SUPERVISOR/RESET IC
JESD-30 Code R-PDSO-G3 R-PDSO-G3
Number of Channels 1 1
Number of Functions 1 1
Number of Terminals 3 3
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Qualification Status Not Qualified Not Qualified
Supply Current-Max (Isup) 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.2 V 1 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Threshold Voltage-Nom 2.63 2.63
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOT-23
Pin Count 3
ECCN Code EAR99
HTS Code 8542.39.00.01
JESD-609 Code e3
Length 2.86 mm
Moisture Sensitivity Level 1
Package Equivalence Code TO-236
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.12 mm
Terminal Finish Matte Tin (Sn)
Terminal Pitch 0.95 mm
Time@Peak Reflow Temperature-Max (s) 40
Width 1.3 mm

Compare TCM810RENB723 with alternatives

Compare TCM810RENBG with alternatives