TCM810RENB723
vs
TCM810RENBG
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
TELCOM SEMICONDUCTOR INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
,
|
TSOP,
|
Reach Compliance Code |
unknown
|
compliant
|
Adjustable Threshold |
NO
|
NO
|
Analog IC - Other Type |
VOLTAGE SUPERVISOR/RESET IC
|
VOLTAGE SUPERVISOR/RESET IC
|
JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
3
|
3
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
TSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Current-Max (Isup) |
0.05 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.2 V
|
1 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Threshold Voltage-Nom |
2.63
|
2.63
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
SOT-23
|
Pin Count |
|
3
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
JESD-609 Code |
|
e3
|
Length |
|
2.86 mm
|
Moisture Sensitivity Level |
|
1
|
Package Equivalence Code |
|
TO-236
|
Peak Reflow Temperature (Cel) |
|
260
|
Seated Height-Max |
|
1.12 mm
|
Terminal Finish |
|
Matte Tin (Sn)
|
Terminal Pitch |
|
0.95 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
Width |
|
1.3 mm
|
|
|
|
Compare TCM810RENB723 with alternatives
Compare TCM810RENBG with alternatives