TC9400CPDG
vs
TC9400EJD
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TELCOM SEMICONDUCTOR INC
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
CERDIP-14
|
| Pin Count |
14
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Converter Type |
VOLTAGE TO FREQUENCY CONVERTER
|
VOLTAGE TO FREQUENCY CONVERTER
|
| JESD-30 Code |
R-PDIP-T14
|
R-GDIP-T14
|
| JESD-609 Code |
e3
|
e0
|
| Length |
19.24 mm
|
|
| Linearity Error-Max (EL) |
0.25%
|
0.25%
|
| Negative Input Voltage-Max |
-2 V
|
|
| Negative Supply Voltage-Max |
-7.5 V
|
|
| Negative Supply Voltage-Min |
-4 V
|
|
| Negative Supply Voltage-Nom |
-5 V
|
-5 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
14
|
| Operating Frequency-Max |
0.1 MHz
|
0.1 MHz
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP14,.3
|
DIP14,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Positive Input Voltage-Max |
5 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Current-Max |
10 mA
|
6 mA
|
| Supply Voltage-Max |
7.5 V
|
7.5 V
|
| Supply Voltage-Min |
4 V
|
4 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
3
|
|
|
|
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