TC7W74FKTE12L
vs
74LVC2G74GM
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
TOSHIBA CORP
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
QFN
|
| Package Description |
VSSOP,
|
HVQCCN, LCC8,.06SQ,20
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
HC/UH
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PDSO-G8
|
S-PQCC-N8
|
| Length |
2.3 mm
|
1.6 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Max Frequency@Nom-Sup |
25000000 Hz
|
175000000 Hz
|
| Max I(ol) |
0.0052 A
|
0.024 A
|
| Number of Bits |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSSOP
|
HVQCCN
|
| Package Equivalence Code |
TSSOP8,.12,20
|
LCC8,.06SQ,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Power Supply Current-Max (ICC) |
25 mA
|
|
| Prop. Delay@Nom-Sup |
38 ns
|
5.9 ns
|
| Propagation Delay (tpd) |
190 ns
|
13.4 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.9 mm
|
0.5 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
2 mm
|
1.6 mm
|
| fmax-Min |
29 MHz
|
200 MHz
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e4
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
TR
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
|
|
Compare TC7W74FKTE12L with alternatives
Compare 74LVC2G74GM with alternatives