TC7S14FU(TE12L) vs HD74HC1G14CME feature comparison

TC7S14FU(TE12L) Toshiba America Electronic Components

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HD74HC1G14CME Renesas Electronics Corporation

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP RENESAS ELECTRONICS CORP
Part Package Code SSOP SOIC
Package Description TSSOP, CMPAK-5
Pin Count 5 5
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G5 R-PDSO-G5
Length 2 mm 2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type INVERTER INVERTER
Max I(ol) 0.0026 A 0.002 A
Number of Functions 1 1
Number of Inputs 1 1
Number of Terminals 5 5
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP5/6,.08 TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 25 mA
Prop. Delay@Nom-Sup 48 ns 25 ns
Propagation Delay (tpd) 235 ns 125 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 1.25 mm 1.25 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Moisture Sensitivity Level 1
Packing Method TR

Compare TC7S14FU(TE12L) with alternatives

Compare HD74HC1G14CME with alternatives