HD74HC1G14CME
vs
74HC1G14GW-Q100H
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
NXP SEMICONDUCTORS
Part Package Code
SOIC
TSSOP
Package Description
CMPAK-5
1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1, TSSOP-5
Pin Count
5
5
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
Length
2 mm
2.05 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
INVERTER
INVERTER
Max I(ol)
0.002 A
0.002 A
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Inputs
1
1
Number of Terminals
5
5
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP5/6,.08
TSSOP5/6,.08
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
TR
Prop. Delay@Nom-Sup
25 ns
38 ns
Propagation Delay (tpd)
125 ns
190 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
YES
YES
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
1.25 mm
1.25 mm
Base Number Matches
1
2
Manufacturer Package Code
SOT353-1
JESD-609 Code
e3
Screening Level
AEC-Q100
Terminal Finish
Tin (Sn)
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