TC7S08FU(TE85L,F)
vs
74HC1G08GW,125
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
TOSHIBA CORP
NXP SEMICONDUCTORS
Part Package Code
SSOP
TSSOP
Package Description
TSSOP, TSSOP5/6,.08
PLASTIC, SC-88A, 5 PIN
Pin Count
5
5
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Toshiba
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
JESD-609 Code
e4
e3
Length
2 mm
2 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
AND GATE
AND GATE
Max I(ol)
0.0026 A
0.002 A
Number of Functions
1
1
Number of Inputs
2
2
Number of Terminals
5
5
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP5/6,.08
TSSOP5/6,.08
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Power Supply Current-Max (ICC)
0.01 mA
Prop. Delay@Nom-Sup
25 ns
27 ns
Propagation Delay (tpd)
125 ns
135 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
1.25 mm
1.25 mm
Base Number Matches
1
2
Manufacturer Package Code
SOT353-1
Moisture Sensitivity Level
1
Packing Method
TR
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