TC7S00F
vs
74AHC1G00GV,125
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
TOSHIBA CORP
NXP SEMICONDUCTORS
Part Package Code
SSOP
TSOP
Package Description
LSSOP, TSOP5/6,.11,37
PLASTIC, SC-74A, 5 PIN
Pin Count
5
5
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Toshiba
Family
HC/UH
AHC
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
Length
2.9 mm
2.9 mm
Load Capacitance (CL)
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.0026 A
0.008 A
Number of Functions
1
1
Number of Inputs
2
2
Number of Terminals
5
5
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSSOP
TSSOP
Package Equivalence Code
SOP5/6,.11,37
TSOP5/6,.11,37
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Power Supply Current-Max (ICC)
25 mA
Prop. Delay@Nom-Sup
25 ns
9.5 ns
Propagation Delay (tpd)
125 ns
14.5 ns
Schmitt Trigger
NO
NO
Seated Height-Max
1.4 mm
1.1 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.95 mm
0.95 mm
Terminal Position
DUAL
DUAL
Width
1.6 mm
1.5 mm
Base Number Matches
1
2
Manufacturer Package Code
SOT753
Factory Lead Time
4 Weeks
JESD-609 Code
e3
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Temperature Grade
AUTOMOTIVE
Terminal Finish
Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
30
Compare TC7S00F with alternatives
Compare 74AHC1G00GV,125 with alternatives