TC7MH157FK
vs
PI3CH360LEX
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
DIODES INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
VSSOP, TSSOP16,.16,20
|
,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| Samacsys Manufacturer |
Toshiba
|
Diodes Incorporated
|
| Family |
LV/LV-A/LVX/H
|
|
| JESD-30 Code |
R-PDSO-G16
|
|
| JESD-609 Code |
e0
|
e3
|
| Length |
4 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER AND DEMUX/DECODER
|
| Number of Functions |
4
|
|
| Number of Inputs |
2
|
|
| Number of Outputs |
1
|
|
| Number of Terminals |
16
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
VSSOP
|
|
| Package Equivalence Code |
TSSOP16,.16,20
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
|
| Prop. Delay@Nom-Sup |
15 ns
|
|
| Propagation Delay (tpd) |
15 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
DUAL
|
|
| Width |
3 mm
|
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare TC7MH157FK with alternatives
Compare PI3CH360LEX with alternatives