TC74VHC157FS
vs
74HCT257D-T
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
TOSHIBA CORP
|
PHILIPS SEMICONDUCTORS
|
Part Package Code |
SOIC
|
|
Package Description |
0.225 INCH, 0.65 MM PITCH, PLASTIC, SSOP-16
|
SOP, SOP16,.25
|
Pin Count |
16
|
|
Reach Compliance Code |
unknown
|
unknown
|
Family |
AHC/VHC
|
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
Length |
5 mm
|
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
4
|
4
|
Number of Inputs |
2
|
2
|
Number of Outputs |
1
|
|
Number of Terminals |
16
|
16
|
Output Polarity |
TRUE
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LSSOP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
225
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
4.4 mm
|
|
Base Number Matches |
1
|
3
|
HTS Code |
|
8542.39.00.01
|
Load Capacitance (CL) |
|
50 pF
|
Max I(ol) |
|
0.006 A
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Output Characteristics |
|
3-STATE
|
Package Equivalence Code |
|
SOP16,.25
|
Packing Method |
|
TR
|
Prop. Delay@Nom-Sup |
|
44 ns
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Temperature Grade |
|
INDUSTRIAL
|
|
|
|
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