TC74VHC157FS
vs
HD74HC257FP-EL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TOSHIBA CORP
RENESAS TECHNOLOGY CORP
Part Package Code
SOIC
SOIC
Package Description
0.225 INCH, 0.65 MM PITCH, PLASTIC, SSOP-16
SOP,
Pin Count
16
16
Reach Compliance Code
unknown
unknown
Family
AHC/VHC
HC/UH
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
5 mm
10.06 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Moisture Sensitivity Level
1
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
SMALL OUTLINE
Peak Reflow Temperature (Cel)
225
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
2.2 mm
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
4.4 mm
5.5 mm
Base Number Matches
1
2
Pbfree Code
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Output Characteristics
3-STATE
Propagation Delay (tpd)
145 ns
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
4.5 V
Temperature Grade
INDUSTRIAL
Compare TC74VHC157FS with alternatives
Compare HD74HC257FP-EL with alternatives