TC74VHC08FW vs HD74LV08RP feature comparison

TC74VHC08FW Toshiba America Electronic Components

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HD74LV08RP Renesas Electronics Corporation

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Active Contact Manufacturer
Ihs Manufacturer TOSHIBA CORP RENESAS ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AHC/VHC LV/LV-A/LVX/H
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 10.3 mm 8.65 mm
Logic IC Type AND GATE AND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 1.75 mm
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 5.3 mm 3.9 mm
Base Number Matches 1 1
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Propagation Delay (tpd) 19.5 ns
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V
Temperature Grade INDUSTRIAL

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