TC74VHC08FT
vs
74LV08PW-Q100,118
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
TOSHIBA CORP
NXP SEMICONDUCTORS
Part Package Code
TSSOP
TSSOP
Package Description
4.40 MM, 0.65 MM PITCH, LEAD FREE, PLASTIC, TSSOP-14
4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14
Pin Count
14
14
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
Samacsys Manufacturer
Toshiba
Family
AHC/VHC
LV/LV-A/LVX/H
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e4
Length
5 mm
5 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
AND GATE
AND GATE
Max I(ol)
0.008 A
0.006 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP14,.25
TSSOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Prop. Delay@Nom-Sup
9 ns
19 ns
Propagation Delay (tpd)
14 ns
33 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
1.2 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
1 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
4.4 mm
Base Number Matches
1
2
Manufacturer Package Code
SOT402-1
Moisture Sensitivity Level
1
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Screening Level
AEC-Q100
Time@Peak Reflow Temperature-Max (s)
30
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