TC74VCX257FK vs HD74ALVC2G157US feature comparison

TC74VCX257FK Toshiba America Electronic Components

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HD74ALVC2G157US Renesas Electronics Corporation

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Not Recommended
Ihs Manufacturer TOSHIBA CORP RENESAS ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description VSSOP, TSSOP16,.16,20 VSSOP,
Pin Count 16 8
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Toshiba
Family ALVC/VCX/A ALVC/VCX/A
JESD-30 Code R-PDSO-G16 R-PDSO-G8
Length 4 mm 2.3 mm
Load Capacitance (CL) 30 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.024 A
Number of Functions 4 1
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Output Polarity TRUE COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSSOP VSSOP
Package Equivalence Code TSSOP16,.16,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 3 ns
Propagation Delay (tpd) 40 ns 11 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 0.9 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 1.2 V
Supply Voltage-Nom (Vsup) 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3 mm 2 mm
Base Number Matches 1 2

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Compare HD74ALVC2G157US with alternatives