TC74VCX257FK
vs
HD74ALVC2G157US
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Not Recommended
Ihs Manufacturer
TOSHIBA CORP
RENESAS ELECTRONICS CORP
Part Package Code
SOIC
SOIC
Package Description
VSSOP, TSSOP16,.16,20
VSSOP,
Pin Count
16
8
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Toshiba
Family
ALVC/VCX/A
ALVC/VCX/A
JESD-30 Code
R-PDSO-G16
R-PDSO-G8
Length
4 mm
2.3 mm
Load Capacitance (CL)
30 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.024 A
Number of Functions
4
1
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
Output Polarity
TRUE
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSSOP
VSSOP
Package Equivalence Code
TSSOP16,.16,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Prop. Delay@Nom-Sup
3 ns
Propagation Delay (tpd)
40 ns
11 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
0.9 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.2 V
1.2 V
Supply Voltage-Nom (Vsup)
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
3 mm
2 mm
Base Number Matches
1
2
Compare TC74VCX257FK with alternatives
Compare HD74ALVC2G157US with alternatives