HD74ALVC2G157US vs HD74ALVC2G157USE-E feature comparison

HD74ALVC2G157US Renesas Electronics Corporation

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HD74ALVC2G157USE-E Renesas Electronics Corporation

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Part Life Cycle Code Not Recommended Not Recommended
Ihs Manufacturer RENESAS ELECTRONICS CORP RENESAS ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description VSSOP, VSSOP, TSSOP8,.12,20
Pin Count 8 8
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family ALVC/VCX/A ALVC/VCX/A
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Length 2.3 mm 2.3 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 1 1
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSSOP VSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 11 ns 11 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.9 mm 0.9 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 1.2 V
Supply Voltage-Nom (Vsup) 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 2 mm 2 mm
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
Load Capacitance (CL) 30 pF
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP8,.12,20
Prop. Delay@Nom-Sup 3.5 ns

Compare HD74ALVC2G157US with alternatives

Compare HD74ALVC2G157USE-E with alternatives