HD74ALVC2G157US
vs
HD74ALVC2G157USE-E
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Not Recommended
Not Recommended
Ihs Manufacturer
RENESAS ELECTRONICS CORP
RENESAS ELECTRONICS CORP
Part Package Code
SOIC
SOIC
Package Description
VSSOP,
VSSOP, TSSOP8,.12,20
Pin Count
8
8
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
ALVC/VCX/A
ALVC/VCX/A
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
Length
2.3 mm
2.3 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
1
1
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSSOP
VSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
11 ns
11 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.9 mm
0.9 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
1.2 V
1.2 V
Supply Voltage-Nom (Vsup)
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
2 mm
2 mm
Base Number Matches
2
1
Pbfree Code
Yes
Rohs Code
Yes
Load Capacitance (CL)
30 pF
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Package Equivalence Code
TSSOP8,.12,20
Prop. Delay@Nom-Sup
3.5 ns
Compare HD74ALVC2G157US with alternatives
Compare HD74ALVC2G157USE-E with alternatives