TC74VCX257FK
vs
IDT74ALVCH16271PA8
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
SOIC
|
TSSOP
|
| Package Description |
VSSOP, TSSOP16,.16,20
|
TSSOP,
|
| Pin Count |
16
|
56
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Toshiba
|
|
| Family |
ALVC/VCX/A
|
ALVC/VCX/A
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G56
|
| Length |
4 mm
|
14 mm
|
| Load Capacitance (CL) |
30 pF
|
|
| Logic IC Type |
MULTIPLEXER
|
BUS EXCHANGER
|
| Max I(ol) |
0.024 A
|
0.024 A
|
| Number of Functions |
4
|
12
|
| Number of Inputs |
2
|
|
| Number of Outputs |
1
|
|
| Number of Terminals |
16
|
56
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP16,.16,20
|
TSSOP56,.3,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Prop. Delay@Nom-Sup |
3 ns
|
6.2 ns
|
| Propagation Delay (tpd) |
40 ns
|
6.2 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
2.7 V
|
| Supply Voltage-Min (Vsup) |
1.2 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
1.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
3 mm
|
6.1 mm
|
| Base Number Matches |
2
|
1
|
| Control Type |
|
ENABLE LOW
|
| Count Direction |
|
BIDIRECTIONAL
|
| JESD-609 Code |
|
e0
|
| Number of Bits |
|
1
|
| Number of Ports |
|
3
|
| Packing Method |
|
TR, 13 INCH
|
| Power Supply Current-Max (ICC) |
|
100 mA
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare TC74VCX257FK with alternatives
Compare IDT74ALVCH16271PA8 with alternatives