TC74LCX245FK
vs
SN74LVCH8T245DBR
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TOSHIBA CORP
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SSOP
|
SSOP
|
| Pin Count |
20
|
24
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Toshiba
|
Texas Instruments
|
| Control Type |
COMMON CONTROL
|
COMMON CONTROL
|
| Count Direction |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G24
|
| Length |
5 mm
|
8.2 mm
|
| Logic IC Type |
BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
| Max I(ol) |
0.024 A
|
0.032 A
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSSOP
|
SSOP
|
| Package Equivalence Code |
TSSOP20,.16,20
|
SSOP24,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Prop. Delay@Nom-Sup |
7 ns
|
6.2 ns
|
| Propagation Delay (tpd) |
25 ns
|
23.8 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
2 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
3 mm
|
5.3 mm
|
| Base Number Matches |
3
|
1
|
| Package Description |
|
GREEN, PLASTIC, SSOP-24
|
| ECCN Code |
|
EAR99
|
| JESD-609 Code |
|
e4
|
| Load Capacitance (CL) |
|
15 pF
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
TR
|
| Power Supply Current-Max (ICC) |
|
0.025 mA
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
Compare TC74LCX245FK with alternatives
Compare SN74LVCH8T245DBR with alternatives