TC74HCT533AF(TP2)
vs
HCTS541DMSH
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TOSHIBA CORP
HARRIS SEMICONDUCTOR
Part Package Code
SOIC
DIP
Package Description
SOP,
DIP,
Pin Count
20
20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
ENABLE TIME @ RL=1K
WITH DUAL OUTPUT ENABLE; RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHNOLOGY
Family
HCT
HCT
JESD-30 Code
R-PDSO-G20
R-CDIP-T20
JESD-609 Code
e0
Length
12.8 mm
Load Capacitance (CL)
150 pF
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
INVERTED
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Propagation Delay (tpd)
48 ns
28 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.9 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
5.3 mm
7.62 mm
Base Number Matches
1
1
kg CO2e/kg
12.3
Average Weight (mg)
4319.45
CO2e (mg)
53129.238
Category CO2 Kg
12.3
Compliance Temperature Grade
Military: -55C to +125C
Compare TC74HCT533AF(TP2) with alternatives
Compare HCTS541DMSH with alternatives