TC74HC76AF-TP1 vs TC74HC112AF-TP2 feature comparison

TC74HC76AF-TP1 Toshiba America Electronic Components

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TC74HC112AF-TP2 Toshiba America Electronic Components

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Active End Of Life
Ihs Manufacturer TOSHIBA CORP TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 10.3 mm 10.3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type J-K FLIP-FLOP J-K FLIP-FLOP
Number of Bits 2 2
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 31 ns 31 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 1.9 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Trigger Type NEGATIVE EDGE NEGATIVE EDGE
Width 5.3 mm 5.3 mm
fmax-Min 25 MHz 24 MHz
Base Number Matches 1 1
JESD-609 Code e0
Terminal Finish TIN LEAD

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