TC74HC76AF-TP1 vs 74HC174D-T feature comparison

TC74HC76AF-TP1 Toshiba America Electronic Components

Buy Now Datasheet

74HC174D-T NXP Semiconductors

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP16,.25
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 10.3 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type J-K FLIP-FLOP D FLIP-FLOP
Number of Bits 2 6
Number of Functions 2 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 31 ns 50 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Trigger Type NEGATIVE EDGE POSITIVE EDGE
Width 5.3 mm 3.9 mm
fmax-Min 25 MHz 20 MHz
Base Number Matches 1 2
JESD-609 Code e4
Max Frequency@Nom-Sup 24000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP16,.25
Packing Method TR
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

Compare TC74HC76AF-TP1 with alternatives

Compare 74HC174D-T with alternatives