TC74HC4514AP
vs
CD74HC4514E96
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
HARRIS SEMICONDUCTOR
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP24,.3
|
DIP,
|
| Pin Count |
24
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Samacsys Manufacturer |
Toshiba
|
|
| Family |
HC/UH
|
HC/UH
|
| Input Conditioning |
LATCHED
|
LATCHED
|
| JESD-30 Code |
R-PDIP-T24
|
R-PDIP-T24
|
| Length |
29.8 mm
|
31 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
4-LINE TO 16-LINE DECODER
|
4-LINE TO 16-LINE DECODER
|
| Max I(ol) |
0.004 A
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP24,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Prop. Delay@Nom-Sup |
44 ns
|
|
| Propagation Delay (tpd) |
220 ns
|
415 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.45 mm
|
6.35 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.62 mm
|
15.24 mm
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Additional Feature |
|
ADDRESS LATCHES
|
|
|
|
Compare TC74HC4514AP with alternatives
Compare CD74HC4514E96 with alternatives