TC74HC4075AP vs 74AC32SC feature comparison

TC74HC4075AP Toshiba America Electronic Components

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74AC32SC onsemi

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Rohs Code Yes
Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer TOSHIBA CORP ONSEMI
Part Package Code DIP
Package Description DIP, DIP14,.3 SOIC-14
Pin Count 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH AC
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Length 19.25 mm 8.625 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OR GATE OR GATE
Max I(ol) 0.004 A 0.012 A
Number of Functions 3 4
Number of Inputs 3 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Prop. Delay@Nom-Sup 23 ns 10 ns
Propagation Delay (tpd) 115 ns 10 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 4.45 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 3.3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 7.62 mm 3.9 mm
Base Number Matches 2 2
Pbfree Code Yes
Manufacturer Package Code 751A-03
Samacsys Manufacturer onsemi
JESD-609 Code e4
Moisture Sensitivity Level 1
Packing Method RAIL
Terminal Finish NICKEL PALLADIUM GOLD

Compare TC74HC4075AP with alternatives

Compare 74AC32SC with alternatives