TC74HC4051AP vs MC74HC4051AN feature comparison

TC74HC4051AP Toshiba America Electronic Components

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MC74HC4051AN Freescale Semiconductor

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Pbfree Code No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code DIP
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Samacsys Manufacturer Toshiba
Additional Feature IT CAN ALSO OPERATE WITH 2 TO 12 V SUPPLY
Analog IC - Other Type SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER
JESD-30 Code R-PDIP-T16 R-PDIP-T16
Length 19.25 mm
Neg Supply Voltage-Max (Vsup) -6 V
Neg Supply Voltage-Min (Vsup)
Neg Supply Voltage-Nom (Vsup) -4.5 V
Number of Channels 8 8
Number of Functions 1 1
Number of Terminals 16 16
Off-state Isolation-Nom 50 dB
On-state Resistance Match-Nom 5 Ω
On-state Resistance-Max (Ron) 55 Ω 280 Ω
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm
Signal Current-Max 0.025 A 0.025 A
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Surface Mount NO NO
Switch-off Time-Max 50 ns
Switch-on Time-Max 45 ns
Switching BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm
Base Number Matches 1 5
JESD-609 Code e0
Power Supplies 2/6,GND/-6 V
Supply Current-Max (Isup) 0.08 mA
Terminal Finish Tin/Lead (Sn/Pb)

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