TC74HC4050AFN-TP1
vs
M74HC4050M1R
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TOSHIBA CORP
STMICROELECTRONICS
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP, SOP16,.25
Pin Count
16
16
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
IOH = 6MA @ VOH = 4.13V; IOL = 6MA @ VOL = 0.33V; WITH EXTENDED INPUT VOLTAGE
CMOS-TTL LEVEL TRANSLATOR
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
9.9 mm
9.9 mm
Load Capacitance (CL)
50 pF
150 pF
Logic IC Type
BUFFER
BUFFER
Number of Functions
6
6
Number of Inputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
240
Propagation Delay (tpd)
19 ns
150 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
3.9 mm
3.9 mm
Base Number Matches
1
1
Samacsys Manufacturer
STMicroelectronics
JESD-609 Code
e4
Max I(ol)
0.004 A
Moisture Sensitivity Level
3
Package Equivalence Code
SOP16,.25
Packing Method
TUBE
Prop. Delay@Nom-Sup
23 ns
Schmitt Trigger
NO
Terminal Finish
NICKEL PALLADIUM GOLD
Compare TC74HC4050AFN-TP1 with alternatives
Compare M74HC4050M1R with alternatives