TC74HC32AFN(TP2) vs 935250080118 feature comparison

TC74HC32AFN(TP2) Toshiba America Electronic Components

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935250080118 NXP Semiconductors

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Lifetime Buy Transferred
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code SOIC TSSOP
Package Description 0.150 INCH, PLASTIC, SOIC-14 4.40 MM, PLASTIC, SOT-402-1, TSSOP-14
Pin Count 14 14
Reach Compliance Code unknown unknown
Family HC/UH LVC/LCX/Z
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 5 mm
Load Capacitance (CL) 50 pF
Logic IC Type OR GATE OR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 240 NOT SPECIFIED
Propagation Delay (tpd) 19 ns 5.9 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 1.2 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 3.9 mm 4.4 mm
Base Number Matches 3 1
HTS Code 8542.39.00.01
kg CO2e/kg 12.4
Average Weight (mg) 62.85
CO2e (mg) 779.34
Category CO2 Kg 12.4
Compliance Temperature Grade Industrial: -40C to +85C
EU RoHS Version RoHS 2 (2015/863/EU)
EFUP e
Conflict Mineral Status DRC Conflict Free
Conflict Mineral Status Source CMRT V4.20
JESD-609 Code e4
Moisture Sensitivity Level 1
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

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