TC74HC32AFN(TP2) vs MC74HC32ADG feature comparison

TC74HC32AFN(TP2) Toshiba America Electronic Components

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MC74HC32ADG Rochester Electronics LLC

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Pbfree Code No No
Rohs Code No Yes
Part Life Cycle Code Lifetime Buy Active
Ihs Manufacturer TOSHIBA CORP ROCHESTER ELECTRONICS LLC
Part Package Code SOIC SOIC
Package Description 0.150 INCH, PLASTIC, SOIC-14 SOP-14
Pin Count 14 14
Reach Compliance Code unknown unknown
Family HC/UH HC
JESD-30 Code R-PDSO-G14 R-PDIP-T
Length 8.65 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OR GATE OR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 240
Propagation Delay (tpd) 19 ns 110 ns
Qualification Status Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm 3.9 mm
Base Number Matches 1 2
HTS Code 8542.39.00.01
Max I(ol) 5.2 A
Package Equivalence Code SOP14,.25
Packing Method TR
Power Supply Current-Max (ICC) 0.04 mA
Prop. Delay@Nom-Sup 22 ns
Schmitt Trigger NO

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