TC74HC32AFN(TP2)
vs
935174750118
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Lifetime Buy
Transferred
Ihs Manufacturer
TOSHIBA CORP
NXP SEMICONDUCTORS
Part Package Code
SOIC
TSSOP
Package Description
0.150 INCH, PLASTIC, SOIC-14
TSSOP,
Pin Count
14
14
Reach Compliance Code
unknown
unknown
Category CO2 Kg
12.4
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
Length
8.65 mm
5 mm
Load Capacitance (CL)
50 pF
Logic IC Type
OR GATE
OR GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
240
NOT SPECIFIED
Propagation Delay (tpd)
19 ns
135 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.1 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
3.9 mm
4.4 mm
Base Number Matches
3
1
HTS Code
8542.39.00.01
JESD-609 Code
e4
Moisture Sensitivity Level
1
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Compare TC74HC32AFN(TP2) with alternatives
Compare 935174750118 with alternatives