TC74HC30P vs 5962-3865004BCX feature comparison

TC74HC30P Toshiba America Electronic Components

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5962-3865004BCX National Semiconductor Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, DIP,
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-GDIP-T14
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 1 1
Number of Inputs 8 8
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 31 ns 41 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 2

Compare TC74HC30P with alternatives

Compare 5962-3865004BCX with alternatives