5962-3865004BCX vs CD54HC30F3A feature comparison

5962-3865004BCX National Semiconductor Corporation

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CD54HC30F3A Intersil Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP INTERSIL CORP
Package Description DIP, DIP, DIP14,.3
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH
JESD-30 Code R-GDIP-T14 R-XDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 1
Number of Inputs 8
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 41 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 2 3
Rohs Code No
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 39 ns
Schmitt Trigger NO
Screening Level 38535Q/M;38534H;883B
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

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Compare CD54HC30F3A with alternatives