TC74HC27AFN-TP2 vs 935188790118 feature comparison

TC74HC27AFN-TP2 Toshiba America Electronic Components

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935188790118 NXP Semiconductors

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code SOIC SSOP
Package Description SOP, SOT-337-1, SSOP-14
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 6.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type NOR GATE NOR GATE
Number of Functions 3 3
Number of Inputs 3 3
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) 240 NOT SPECIFIED
Propagation Delay (tpd) 23 ns 135 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 3.9 mm 5.3 mm
Base Number Matches 1 2
JESD-609 Code e4
Moisture Sensitivity Level 1
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

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Compare 935188790118 with alternatives