TC74HC27AFN-TP2 vs 74HC27DB,112 feature comparison

TC74HC27AFN-TP2 Toshiba America Electronic Components

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74HC27DB,112 NXP Semiconductors

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code SOIC SSOP1
Package Description SOP, SOT-337-1, SSOP-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 6.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NOR GATE NOR GATE
Number of Functions 3 3
Number of Inputs 3 3
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) 240 260
Propagation Delay (tpd) 23 ns 27 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 3.9 mm 5.3 mm
Base Number Matches 1 2
Manufacturer Package Code SOT337-1
JESD-609 Code e4
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SSOP14,.3
Packing Method TUBE
Prop. Delay@Nom-Sup 23 ns
Schmitt Trigger NO
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

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Compare 74HC27DB,112 with alternatives